DISCO develops precision processing equipment and tools for semiconductor manufacturing. Its cutting, grinding and polishing technologies support wafer thinning and separation into individual chips.
History and development
Disco began as Dai-Ichi Seitosho in Kure, Hiroshima, in 1937 and was incorporated in 1940. Grinding wheels provided the foundation for precision cutting and thinning technology. That heritage led to semiconductor dicing and grinding equipment rather than chip production itself.
References: Disco: history